Chapter 17 - St. Louis Scholarship

Applicant must be a student enrolled in a manufacturing engineering, industrial technology, or other related program. First preference will be given to applicants who reside within the boundaries of St. Lewis Chapter 17. Second preference will be given to applicants who reside within the state of Missouri. A minimum 2.5 GPA is required.

Award may only be used only as a credit toward books, fees, or tuition.

Recipient must reapply for renewal.

Study areas: manufacturing engineering, industrial technology

Details

Deadline: February 1

Award type: Scholarship

Renewable
Yes
Min. award:
$1,000
Awarded anualy:
Yes
Unlimited awards:
No
Repay required:
No

Other criteria

Min. GPA:
3
Max. GPA:
4

Misc.

Enrollment level: College Senior, College Sophomore, College Junior, College Freshman

Country: United States

State: Missouri

Major: Industrial/manufacturing Engineering, Manufacturing Engineering, Industrial/manufacturing Tech./technician

Misc: Full-time Student, Part-time Student, St. Lewis Chapter 17 Resident

Contact Information

United States
Phone: (313) 425-3300

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